国家/地区 德国（4）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC B32B007/12（4）
发明人 ATIAS B（2） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） LEVI A（2） LIPP E（2）
MENTOVICH E（2） NAVEH D（2） ROTEM Y（2）
公开年 2022（2）
申请年 2022（2） 
专利权人 MELLANOX TEC.（2） PCB TECHNOLO.（2） UNIV BARILAN（2）

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Plastic composition useful for forming product in connection structure, and coated body, comprises a polyamide resin and a graphene oxide.

SHIOZAKI R

Adhesive useful for bonding aluminum-polyurethane composite material, comprises graphene oxide comprising epoxy, hydroxy or carboxylic acid group, and alkoxysilane compound comprising amine, epoxy, carboxylic acid, hydroxy or thiol group.

CHO H C, LEE S H, LEE D S, KANG K H, CHEOL C H, HUN L S, SU L D, HO G G, KANG K, LEE D, LEE S, CHO H