国家/地区 世界知识产权组织（5）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC B32B009/00（4） C01B032/182（4） B32B007/12（3）
B32B037/12（3） B32B015/04（2） B82Y040/00（2）
H05K003/46（2）
发明人 ATIAS B（2） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） LEVI A（2） LIPP E（2）
MENTOVICH E（2） NAVEH D（2） ROTEM Y（2）
公开年 2023（3） 2022（2）
申请年 2022（5）
专利权人 MELLANOX TEC.（2） PCB TECHNOLO.（2） UNIV BARILAN（2）

System for realizing formation of high throughput and high yield graphene for use in applications such as batteries, ultra-capacitors and fuel-cells, has gas distribution subsystem for dispensing annealing gas composition to inner side of processing sub-enclosure.

PHILPOTT R, BARAKET M, SHERRILL V

Manufacture of laminated graphene-based thermally conductive film used for electronic assembly, involves providing laminated film comprising graphene film layers separated by adhesive and comprising graphene sheets aligned with plane of graphene film.

LIU J, LAUBECK T

Glass article useful in device, comprises ion-exchanged glass layer, negatively doped graphene layer having negatively doped graphene layer first major surface and negatively doped graphene layer second major surface.

BHATTACHARYYA I, MARCHENA MARTINFRANCES M, MAZUMDER P, PRUNERI V

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A