国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC B32B037/10（3）
发明人 WANG Y（3）
公开年 2021（2）
申请年
专利权人

Encapsulating resin composition useful for a surface acoustic wave device, comprises a resin matrix and a filler, where the resin matrix contains an epoxy resin and an epoxy resin curing agent.

LU B, CAO T, WU Y, WANG Y

Processing graphene phenolic polymer composite air duct sheet involves using phenolic resin, curing agent, foaming agent and graphene water agent.

ZHANG C, WANG Y

Graphene modified polyurethane insulation board comprises first cement heat cloth, graphene modified polyurethane insulation layer and the second cement heat cloth.

WANG Y, KONG X, ZHANG Z