国家/地区 中国（2）
IPC部 B（2）
IPC大类 B21（2）
IPC小类 B21B（2）
IPC B21B003/00（2）
发明人
公开年 2022（2）
申请年 2022（2）
专利权人

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Preparing graphene metal layered composite material useful in aerospace industry, aviation industry and information industry, comprises pre-treating solid carbon source, growing graphene on many metal substrates and hot-pressing many graphene metal substrates.

SHAO L, LI X, ZHANG Y, LI Z, HUANG D, SHI H, DUAN Y