国家/地区 中国（4）
IPC部 B（4）
IPC大类 B22（4） C22（4） H01（2）
IPC小类 B22D（4）
IPC C22C009/00（4）
发明人
公开年 2022（3）
申请年 2021（4）
专利权人

Metal-based composite material for use in heat sink of electronic device, has reinforcement particles comprising silicon carbide particles, diamond particles, boron carbide particles or graphene particles dispersed in metal matrix, where metal matrix has single metal matrix or alloy matrix.

WANG L, LI Q, ZHAO J

Superconducting copper comprises oxygen-free copper, graphene, lead, niobium, and titanium.

MU Y, HU W

Method for Preparing oxidation resistant copper-based surface enhanced Raman scattering substrate, involves adding alloy strip into hydrochloric acid ethanol solution to remove alloy to obtain nano porous copper, carrying out acid washing on nano porous copper, and washing oxide layer off.

LIU J, NING J, ZHANG L, CHEN C, PAN D

Preparation of copper infiltrated wire involves mixing nickel, manganese, iron, zinc, and copper, adding mixture into vacuum melting furnace, molding alloy solution, forging and turning alloy ingots in electric furnace, hot rolling alloy bars into discs, drawing disc, and cutting alloy wire.

ZHOU B, TIAN D, GUO C, SUN J, WANG Q, LIU X, GOU S, LIU Q, LIANG X