国家/地区 中国（2）
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C01B021/064（2）
发明人
公开年 2021（2）
申请年
专利权人

Transferring two-dimensional materials involves bonding the side of the growth substrate with the two-dimensional material and support layer through adhesive layer to obtain layered structure, removing growth substrate in etching solution.

LIU J, WANG H, XU Z, JIANG X

Preparing two-dimensional materials by using oxide semiconductor nanopowders to exfoliate layered materials comprises e.g. selecting p-type semiconductor nanopowders, and grinding and compounding exfoliated material.

SU L, WANG X, WANG B, SUO Y, AKEZHUOLI Q, AN L, YAN F, HUANG W