国家/地区 美国（3）
IPC部 B（3）
IPC大类 B82（3）
IPC小类 B82Y（3）
IPC B82Y040/00（3）
发明人 JANG B Z（3） ZHAMU A（3）
公开年
申请年
专利权人 ZHAMU A（3）

Making integral 3-dimensional graphene-carbon hybrid foam used e.g. to make fumed heat sink and heat pipe, comprises e.g. mixing multiple particles of -graphitic material and -solid polymer carrier material in impacting chamber.

ZHAMU A, JANG B Z

Graphene-based heat dissipation system for e.g. portable microelectronic device, has heat-conducting layer comprising sheet of integrated graphene film, which shields component or external surface of electronic device from heat.

ZHAMU A, WANG M, XIONG W, JANG B Z

Article for thermal management in electronic device comprises non-woven aggregate of nano-scaled graphene platelets of specific thickness to form electrical network of platelets in contact with other platelets to form conductive pathways.

JANG B Z, ZHAMU A, GUO J