国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3） C09（3）
IPC小类 C08K（3）
IPC C09K005/14（3）
发明人 CHEN C（2） WANG D（2） YANG L（2）
ZHAO J（2） ZHAO X（2） ZHOU H（2）
公开年 2023（3）
申请年 2023（3）
专利权人 UNIV JILIN（2）

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D