国家/地区 韩国（5）
IPC部 C（5）
IPC大类 C09（5） C08（4） C01（2）
IPC小类 C09D（5）
IPC C09D011/03（5）
发明人
公开年 2022（2） 2023（2）
申请年 2021（5）
专利权人

Manufacturing conductive ink useful in circuit board for next generation electronic device comprises e.g. mixing guar gum, xanthan gum, or hydroxyethyl cellulose with heated solvent, and mixing ethylene glycol, or propylene glycol.

HYOYOUNG M

Producing nanosheet dispersion comprises reducing interlayer bonding strength by adding two-dimensional material having layered structure into solution containing aionic material and forming covalent bond by entering between layers.

NOHYONGYOUNG, KIM H J, KIM H, NOH Y Y, LU R

Manufacturing plastic card with graphene-antenna comprises preparing colloidal solution including graphene and preparing graphene ink component by mixing colloidal solution, water-dispersible polyurethane solution, and crosslinking agent.

PARK H R

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Conductive ink composition for removing static electricity, comprises filler having silver-coated core-shell structure, specific multi-component binder, viscosity/reflectance modifier containing carbon black and/or graphene, and solvent.

YEONG H, TO Y, LEE S Y