国家/地区 印度（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC C09D163/00（2）
发明人
公开年
申请年 2020（2）
专利权人

Liquid formulation used to form film on both porous and non-porous substrates e.g. wood, plastics, glass, ceramics, paper, metal, and cemented surfaces, comprises nanostructures, stabilizer, film forming polymer and solvent.

AGRAWAL A K, JASSAL M, ARORA V

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K