国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC C09D007/61（2）
发明人 WANG Y（2）
公开年
申请年
专利权人

Heat conducting interface material useful in electronic product and/or automobile field comprises heat-conducting film layer compounded on first resin layer and second resin layer compounded on heat-conducting film layer.

WANG Y

Three-dimensional composite heat sink paste containing liquid metal comprises graphene material, liquid metal, film forming auxiliary agent, auxiliary agent and solvent.

CHANG G, WANG Y, LI R