国家/地区 中国（2）
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C09D101/28（2）
发明人
公开年 2020（2）
申请年 2020（2） 
专利权人

Preparing nitrogen-doped graphene-copper complex heat dissipation film comprises e.g. ball milling graphene oxide, nitrogen dopant and molecular bridging agent, heat treatment, mixing nitrogen-doped graphene and binder dispersion.

CHENG W, LI L, MU F

Graphene heat dissipation coating used for radiator, comprises graphene-thermal conductive particle heterojunction material, where thermal conductive particle comprises aluminum nitride, gallium nitride, aluminum oxide and silicon oxide.

WANG L, DENG M, YUAN K, ZHANG Q, ZHANG T, FAN Y