国家/地区 中国（5） 世界知识产权组织（2）
IPC部 C（6）
IPC大类 C01（6） C25（6）
IPC小类 C01B（6）
IPC C01B032/194（6）
发明人 HU Y（2） JI S（2） LIN J（2）
LIN R（2） OTHER I R N（2） SHEN Q（2）
WANG C（2） XU Z（2） ZENG L（2）
ZHENG J（2） ZHOU J（2）
公开年 2022（3） 2023（3）
申请年 2022（6）
专利权人 ZHEJIANG CHI.（2）

Method for preparing high-conductivity nanometer graphene colloid useful in field of printed circuit board involves mixing nano-graphene material with additive, dissolving in water, and performing ball milling and ultrasonic dispersion treatment.

ZHAO Y, CHAI X, HU C, YANG G

Preparing nano-copper/graphene composite coating using pulse brush plating technology comprises e.g. sensitizing the graphene surface, preparing the suspension, adding surfactant, performing electroless copper plating, ultrasonically stirring, and adopting brush plating solution to prepare coating.

WANG J, QIAO Y, WANG X, LIU S, ZOU Y, ZHAO G

Controlling electrical sedimentary graphene film in Zeta potential comprises scattering graphene in water to prepare graphene dispersing solution, separating graphene slurry, scattering graphene paste in different speed intervals in water, cleaning and fixing ultrasound in electrolyte as anode.

ZHANG J, LIANG A, ZHANG X, WANG F

Manufacture of aerospace component involves treating surface of polymeric substrate with laser to form porous graphene at surface, and bonding metallic layer to porous graphene.

POTEET S, HUAPAYA R L N, BORDAGE K R, ROJAS HUAPAYA L N, ROJAS L N R

Composite dispersant useful in preparing mixed electroplating solution comprises distilled water, Tween composite as nonionic surfactant, hydrocarbyl sulfonate composite as anionic surfactant, and amide composite as wetting agent.

HU Y, WANG C, LIN R, JI S, XU Z, ZHOU J, ZENG L, SHEN Q, LIN J, ZHENG J, OTHER I R N

Composite dispersant useful in mixed electroplating solution, comprises distilled water, polysorbate as non-ionic surfactant and wetting agent containing hydrocarbyl sulfate compounds and hydrocarbyl sulfonate compounds.

JI S, XU Z, ZHOU J, ZENG L, SHEN Q, LIN J, ZHENG J, HU Y, WANG C, LIN R, OTHER I R N