国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人 LIN Z（2）
公开年
申请年 2022（2）
专利权人

Porous metal type conductive adhesive film, comprises upper adhesive layer, ultra-thin porous metal layer and lower adhesive layer, and ultra-thin porous metal layer formed between upper adhesive layer and lower adhesive layer.

LI J, LIN Z, GAO J, WANG Y, LI W

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J