国家/地区 中国（2） 美国（2）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C25D（4）
IPC C25D005/54（4）
发明人
公开年
申请年 2022（2） 
专利权人

Preparing resin-based composite material filled with high heat-conducting three-dimensional framework foam useful in displaycard radiating, comprises e.g. copolymerizing three-dimensional framework foam after electro-deposition by resin system by liquid-phase vacuum dipping, solidifying and forming.

LI W, ZHAO Y, WU X, YAN K, XU K, SHI S, WANG Y, JIANG T

Manufacture of aerospace component involves treating surface of polymeric substrate with laser to form porous graphene at surface, and bonding metallic layer to porous graphene.

POTEET S, HUAPAYA R L N, BORDAGE K R, ROJAS HUAPAYA L N, ROJAS L N R

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Producing surface-metalized polymer film for e.g., diffusion barrier coating, by depositing graphene sheets and conductive filler to primary surface of film, moving graphene-coated film into metallization chamber, and collecting film.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z