国家/地区 中国（2）
IPC部 C（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC C23C014/35（2）
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Preparing ultra-thin radiating fin used in electronic device, and integrated circuit , involves preparing metal radiating sheet with array pattern on surface of metal foil by nanometre stamping template, and depositing vertical graphene film array on surface.

PAN Z, TAN H