国家/地区 台湾（2）
IPC部 B（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC
发明人
公开年 2021（2）
申请年 2020（2） 
专利权人

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y