国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C25D（3）
IPC C08L063/00（2）
发明人
公开年 2021（3）
申请年 2020（3）
专利权人

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Composition useful as catalysts and electrodes, comprises a nanoporous carbon powder comprising nanopores having disposed in it copper metal nanostructures and an elemental copper nanowires.

NAGEL C J, BRODEUR C L, NAZEL C A J, BRODARD C L

Continuous electrophoretic deposition modified carbon fiber reinforced multi-matrix composite material comprises carbon fiber, inorganic powder including graphene powder, aluminum oxide powder and/or zirconium oxide powder, and substrate.

CHEN Z, LIAO J