国家/地区 美国（2）
IPC部 C（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC C23C026/00（2）
发明人 TABOR C E（2）
公开年 2021（2）
申请年
专利权人

Encapsulate used to connect electrical and thermal connections has liquid metal core of liquid metal having mercury, indium and/or gallium and/or alloy having mercury, tin, indium and/or gallium and lead, antimony, cadmium, bismuth, aluminum, zinc, silver, gold and/or thallium and shell.

CREIGHTON M A, MORRIS N J, FARRELL Z J, TABOR C E

Encapsulate comprises a liquid metal core, and liquid metal core comprising at least one of mercury, indium, gallium and mixtures, and at least one of lead, antimony, cadmium, bismuth, aluminum, zinc, silver, gold, or titanium.

CREIGHTON M A, MORRIS N J, FARRELL Z J, TABOR C E