国家/地区 中国（3）
IPC部 C（4）
IPC大类 C09（4）
IPC小类 C09D（4）
IPC C09D175/04（4）
发明人
公开年 2021（4）
申请年 2020（2）  2021（2） 
专利权人

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Characteristic response material useful for monitoring and detecting hydrogen sulfide gas leakage and in field of petrochemical industry, comprises matrix material, modified anthocyanin and titanium dioxide porous microsphere.

TANG Y, LI S, ZHANG H, LIN B, WANG Y

Electronic skin comprises e.g. encapsulation layer arranged on sensing layer, glue layer arranged on bottom of base layer and release paper arranged on glue layer, base layer and packaging layer are provided with heat dissipation layer.

JIANG Z, LI W

High-safety composite electric heating film comprises electric heating layer arranged between upper electrode layer and lower electrode layer, and insulating and heat-conducting discoloring body attached to lower electrode layer.

XIA Y, CAI P, ZHANG W, HUANG H, GAN Y, LIANG C, ZHANG J, HE X