国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D003/56（2）
发明人 WANG F（2）
公开年 2022（2）
申请年
专利权人

Gold palladium plating solution useful for electroplating copper wiree, comprises water-soluble gold salt, palladium salt, graphene quantum dot, ethylenediamine, complexing, conductive salt, buffer, stabilizer and solvent.

WANG F

Preparation of cobalt-nickel base composite material used for hydrogen evolution electrode, involves placing base material into electroplating solution, and forming composite material on surface of base material at preset deposition current density.

WANG F, XIN S