国家/地区 韩国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09J（2）
IPC C09J011/04（2）
发明人 HEE L Y（2）
公开年 2023（2）
申请年 2021（2）
专利权人 DONG WON INT.（2）

Heat dissipation adhesive sheet comprises copper graphene composite sheet filled with crude graphene solution, where crude graphene solution is coated on copper mesh and graphene resin layer formed on graphene composite sheet.

HEE L J, HEE L Y, CHOIJINHO

Flexible heat-dissipating adhesive sheet comprises thermally conductive adhesive layer formed on one surface of copper sheet and graphene layer formed on other surface of copper sheet in which graphene and synthetic resin are mixed.

HEE L J, HEE L Y, CHOIJINHO