国家/地区 中国（6）
IPC部 C（6）
IPC大类 C09（6）
IPC小类 C09D（6）
IPC C09D179/08（6）
发明人 CAO H（2） LIU G（2） XU Z（2）
ZHANG Q（2） ZHU C（2）
公开年 2023（2）
申请年 2022（2） 
专利权人 ZHEJIANG ZHO.（2）

Polyimide paint useful for high heat-resistant enameled wire for electronic appliances, household appliances and instrument equipment, comprises polyamic acid solution obtained by polycondensation of aromatic dianhydride, aromatic diamine and fluorinated amino graphene.

XU Z, LIU G, ZHU C, CAO H, ZHANG Q

High thermal conductivity aluminum-based liquid cooling plate base material used in power battery system, comprises aluminum plate and polyimide layer coated on aluminum plate and polyimide layer comprises polyimide and graphene/cuprous oxide composites uniformly dispersed in polyimide.

XU Z, LIU G, ZHU C, CAO H, ZHANG Q

Flexible heating film comprises conductive structure comprising carbon nanotubes and/or graphene, and polyimide backbone that is chemically linked to aminated conductive structure via anhydride bonds.

ZHENG T, ZHANG M, ZHANG Y, MAO O, ZUO B

Coating composition used to form stacked structure, and manufacture display device comprises graphene oxide, and solvent.

SHIN H K, SEO D K, SIM J H, CHO W J, KANG B H, MOON S J, PARK S C, SEO H W, CHO J E, SHIN K S, SHIN H, SUH D, SHIM J H, KANGBYOUNGHUN, WON S H, EUN J J, SOON S, SHEN X, XU D, SHEN J, CAO Y, JIANG B, WEN S, PARK S, SEO H, CHO J, SHIN G

Preparing fluorinated graphene/polyimide enameled wire involves carrying out polymerization on diamine, dianhydride and fluorinated graphene, and soaking copper wire in synthesized fluorinated graphene/polyamic acid solution.

HE D, ZHANG B

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN