国家/地区 中国（76）
IPC部 C（76）
IPC大类 C09（76）
IPC小类 C09J（76）
IPC H05K007/20（46） C09J007/29（40） C09J011/04（24）
H05K009/00（23） C09J007/30（15） C09J009/02（10）
B32B037/12（9） C09J007/20（9） C09J163/00（8）
B32B007/12（7） B32B009/00（6） B32B009/04（6）
C09J133/08（6） B32B033/00（5） C09J007/25（5）
发明人 YANG S（6） CAO Y（5） HE X（5）
DOU L（4） LIU J（4） SUN A（4）
ZHOU X（4） ZHU Q（4） FANG X（3）
ICHIKAWA I（3） ISAO I（3） LI F（3）
LI J（3） LIU X（3） TAKEO Y（3）
公开年 2022（26） 2021（23） 2020（11） 2023（8） 2018（2） 2019（2）
申请年 2021（31）  2020（18）  2022（13）  2019（8）  2016（2）  2017（2） 
专利权人 SHENZHEN HFC.（4） LINTEC CORP（3） CHENGDU AIOU.（2） DONGGUAN HON.（2）
HANGZHOU FUX.（2） SUZHOU XUYUA.（2） YANCHENG JIU.（2）

Wave-absorbing and heat-conducting material useful in electronic component, comprises binder, tackifying resin, thickener, dispersant, agent, defoamer, wetting agent, wave-absorbing agent and heat-conducting agent.

LV G, MENG C, WANG B, YANG Y

Electronic shielding adhesive structure, has shielding adhesive device fixed between first object and second object and comprising adhesion mechanism, shielding mechanism, heat conducting mechanism and damping mechanism.

YANG S, JIN Y, ZHOU Z, LIN H

Low-density composite electromagnetic shielding plate used in electronic product comprises electromagnetic wave-absorbing foam layer arranged between two composite shield layers, and composite shielding layer, and glass fiber-reinforced epoxy insulating layer are alternately stacked.

LI H

Graphene heating uniform heating film for e.g. point heating bed, has heating component whose outer side is equipped with heat conducting uniform mechanism, and outer layer group equipped with automatic packaging component.

CHAO L, BAO Y, HU H, CHEN Y, MENG K

Electromagnetic shielding protective film used for electronic applications, comprises metal foil layer, and conductive adhesive layers comprising organic siloxane modified acrylic ester adhesive and conductive filler, arranged on both sides of metal foil layer.

LUO X, DING Z, LIU S

Ultra-thin graphite radiating film for use in electronic device, has release material layer adhered on surface of heat-conducting adhesive layer, where surface of material layer and adhesive layer contact is provided with convex points.

JIANG D, LIU J, ZHOU E

Pressure-resistant high-strength graphite heat-conducting component for use in e.g. mobile phone, has connecting part fixedly connected with another connecting part such that metal frame plates are connected to form whole.

YANG F, JIANG S

Epoxy thermally conductive structural adhesive useful in thermally conductive bonding of metal and components, polychlorinated biphenyl and thermal dissipation aluminum substrate, comprises e.g. phenolic modified epoxy resin, flake graphite, toughening agent, curing agent, dispersant, and stabilizer.

CHEN Z, CAO N, LI F

Heat-conducting wave-absorbing material with electromagnetic shielding function has a two-layer structure, the upper layer is a heat-conducting wave-absorbing gel layer, and the lower layer is an aluminum foil layer.

ZHANG X, YANG Y, FAN J, ZHANG C, MA C, WANG Z

Producing resin-based ceramic composite copper clad plate comprises e.g. adding modified hexagonal boron nitride powder into graphene oxide solution, mixing epoxy resin and carboxy-terminated nitrile rubber, coating glue on surface of aluminum plate, and laminating copper foil on glue layer surface.

SONG S