国家/地区 台湾（4）
IPC部 C（4）
IPC大类 H01（4）
IPC小类 H01L（2）
IPC
发明人
公开年 2023（4）
申请年 2022（4）
专利权人

Palladium-silver-copper alloy wire rod for use in wafer testing, comprises palladium, silver, graphene copper, indium and unavoidable impurities.

CHUANG Y H, QIU L, CHAO C Y

Process used for purification of graphite material, involves subjecting graphite material to oxidizing conditions, subjecting metal sulfide-lean graphite material to carbochlorination, and purging metal chlorides from metal chloride-rich graphite material, thus obtains purified graphite material.

BOISVERT R, BOULANGER P, BRASSARD M, DESAULNIERS E, NORVAL G, RIECKMANN P, TAN A, TAN Z

Forming dual damascene structure on semiconductor substrate, involves selectively depositing carbon layer on exposed metal surface.

PARBATANI A, VAN SCHRAVENDIJK B J, VARADARAJAN B N, NARKEVICIUTE I, SRINIVASAN E, SHARMA K, KNARR R, SCHMITZ S, RAMANAN V, NOGAMI T, NGUYEN S V, HUANG H, SHOBHA H K, LI J, PEETHELA C B, EDELSTEIN D C

Water absorbing, electrically conductive composition used as sensor for erosion and/or corrosion monitoring, comprises water soluble and/or water swellable and/or water absorbing resin, electrically conductive filler, and solvent.

TATHE D, SHAH J P