国家/地区 美国（4） 中国（3） 世界知识产权组织（3） 日本（2）
IPC部 B（4）
IPC大类 B32（4） F28（3） H01（3）
C01（2） C09（2）
IPC小类 B32B（4） F28F（3） C01B（2）
C09K（2） H01M（2）
IPC B32B009/00（4）
发明人
公开年 2014（2）
申请年 2014（4）
专利权人

Graphene-based thermal management core for printed wiring boards (PWB) used for electronics applications, e.g., consumer electronics, has first or second reinforcement layer which includes substrate impregnated with non-dielectric resin.

SCHNEIDER D, DAVIS W E

Composition, used in a phase change material which is useful e.g. as thermal conductivity substrate for flexible graphene electronic devices, as electrode in battery, and in a thermal storage device, comprises galactitol and mannitol.

DA SILVA A K, FLEMING E, SHI L, BIELAWSKI C W, RUOFF R S, WEN S, JI H, PETTES M, PAUL A, PAEK E, PAK A J, SELLAN D P, FLAMING E, DA SILVAA A K

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Graphene/metal composite material preparation method, involves adding polyethylene alcohol to distilled water to obtain mixture solution, filling polyethylene alcohol and distilled water in cell, and connecting metal plate with block.

YANG C, LIU D, DAI S, HONG Q, LIN Z, YAN S