国家/地区 美国（4） 世界知识产权组织（3） 中国（2） 欧洲专利局（EPO）（2） 日本（2）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC B32B009/00（3） F28F021/02（3） F28F021/08（3）
B82Y030/00（2） C09K005/14（2） F28F013/00（2）
发明人
公开年 2016（2）
申请年 2014（4）
专利权人

Composite structure comprises organic resin, carbon fiber and flat graphene nanosheets embedded in resin.

LUTZ M, TANZILLI D, BURGER N, LAACHACHI A

Graphene-based thermal management core for printed wiring boards (PWB) used for electronics applications, e.g., consumer electronics, has first or second reinforcement layer which includes substrate impregnated with non-dielectric resin.

SCHNEIDER D, DAVIS W E

Composition, used in a phase change material which is useful e.g. as thermal conductivity substrate for flexible graphene electronic devices, as electrode in battery, and in a thermal storage device, comprises galactitol and mannitol.

DA SILVA A K, FLEMING E, SHI L, BIELAWSKI C W, RUOFF R S, WEN S, JI H, PETTES M, PAUL A, PAEK E, PAK A J, SELLAN D P, FLAMING E, DA SILVAA A K

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X