国家/地区 韩国（2）
IPC部 F（2）
IPC大类 F28（2）
IPC小类 F28D（2）
IPC
发明人
公开年 2022（2）
申请年 2021（2）
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Heat exchanger for wastewater, has module block that is assembled on surface of heat transfer plate, and is fitted in arbitrary area of irregularities formed at regular intervals over entire area of transfer plate.

HO H M