国家/地区 美国（7）
IPC部 C（7）
IPC大类 C09（7）
IPC小类 C09K（7）
IPC C09K005/14（5） F28D020/02（4） C09K005/06（3）
F28D021/00（2） F28F021/00（2） F28F021/02（2）
H01M004/66（2）
发明人 JANG B Z（3） ZHAMU A（3） LIN Y（2）
XIONG W（2）
公开年 2021（3）
申请年 2020（2） 
专利权人 NANOTEK INST.（3）

New arylazo-heteroaryl compounds used as thermal-storage material for thermal-storage device to store thermal energy.

HAN G G D, GERKMAN M A, FISHER R, FUCHTER M J, GROSSMAN J C, GIBSON R, HAN G D

System used for energy storage, consists of fluidized bed apparatus with energy storage material comprising volume having largest size in preset interval, and coated with outer layer of solid particles having largest size in preset interval.

CROON L, BLACKMAN C

Phase change composite useful in a heat spreader, comprises a structure in which phase change material unit layers and thermal conductive layers are sequentially laminated.

KIM D R, HEU C S, KIM S H, LEE H S, SON H W, KIM D, HO K S, LEEHEUNGSOO

Metal-bonded graphene foam product used as e.g. heat spreader comprises sheet or roll of solid graphene foam, having sheet plane and sheet thickness direction, composed of multiple pores (cells) and pore walls, and metal.

LIN Y, ZHAMU A, JANG B Z

Thermally conductive composite material used in electronic device e.g. CPU, comprises unitary graphene matrix material which is single crystal or polycrystalline, and contains chemically bonded graphene molecules or merged graphene planes.

ZHAMU A, XIONG W, JANG B Z, LIN Y

Composition, used in a phase change material which is useful e.g. as thermal conductivity substrate for flexible graphene electronic devices, as electrode in battery, and in a thermal storage device, comprises galactitol and mannitol.

DA SILVA A K, FLEMING E, SHI L, BIELAWSKI C W, RUOFF R S, WEN S, JI H, PETTES M, PAUL A, PAEK E, PAK A J, SELLAN D P, FLAMING E, DA SILVAA A K

Integrated heat sink used in electronic device e.g. battery, camera unit comprises unitary graphene material article composed of heat collection member and heat dissipation member integral to the heat collection member.

ZHAMU A, WANG M, XIONG W, JANG B Z, YIJUN L