国家/地区 中国（2）
IPC部 F（2）
IPC大类 F28（2）
IPC小类 F28D（2）
IPC
发明人 LU J（2）
公开年 2022（2）
申请年
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Method for preparing medium transmission core in heat pipe for use in mobile phone, computer and other electronic products, involves reducing graphene oxide films by performing flame firing process, and performing high temperature thermal reduction process.

SU D, TANG Z, LU J, ZHOU R, ZHOU B