国家/地区
IPC部 B（2）
IPC大类 C01（2）
IPC小类 C01B（2） C08K（2） C08L（2）
C09D（2） H01L（2） H05K（2）
IPC C08K003/04（2）
发明人
公开年
申请年
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Manufacture of graphene used for manufacture of graphene junction, involves applying load to aggregated-form graphite particles, such that interlayer bonding of all graphite crystals of aggregated-form graphite particles is destroyed.

KOBAYASHI H