国家/地区 台湾（2） 美国（2）
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC
发明人 CHUNG C（2）
公开年 2022（2）
申请年
专利权人

Integrated chip comprises substrate, first conductive component above substrate and second conductive component, upper portion of substrate and transversely adjacent to first conductive component where concave hole transversely separating first conductive component and second conductive component.

SUI X, LI M, CHUNG C, LU M, YANG S, SHUE S, LEE M

Manufacturing aluminum nitride used as packaging substrate of semiconductors, involves heating electrolyte comprising choline chloride, urea, aluminum chloride, boric acid and ascorbic acid, applying operating current to electroplate aluminum on workpiece, and annealing aluminum on the workpiece.

CHUNG C, LEE C, PENG K, KUNZENG P, LEE C Y, ZHONG Q