国家/地区 台湾（3）
IPC部 C（4）
IPC大类 C01（4）
IPC小类 C01B（4）
IPC C01B032/182（4）
发明人 HUANG C（4）
公开年 2022（2）
申请年 2019（2）  2021（2） 
专利权人 CTRON ADVANC.（2）

Heat dissipation structure for electronic device e.g. mobile phone, has heat dissipation module whose side protrudes from top surface of heat generating element, and does not contact with surface of carrier.

HE M, HUANG H, HUANG C

Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.

HE M, HUANG H, HUANG C

Heat transfer enhancement device, has substrate provided with heating surface, and graphene layer uniformly coated on heating surface and provided with graphene surface and working fluid, where working fluid is exchanged with surface of graphene.

YANG C, SU C, HUANG C, JHANG B

Preparing three-dimensional graphene composites based on benzyl alcohol route comprises hydrothermally synthesizing nano particle, preparing three-dimensional zinc ferrite/graphene oxide/glassy carbon electrode material and modifying.

ZHU G, WEI W, SHAO S, XIE J, HUANG C, TANG L, YE X