国家/地区 法国（3）
IPC部 B（3）
IPC大类 C04（3）
IPC小类 C04B（3）
IPC B22F001/02（2）
发明人
公开年 2021（3）
申请年 2020（2） 
专利权人

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Additive manufacturing process for forming component, involves partially coating grains of layer of metallic or ceramic powder with film of additive material, at end of deposition of layer of powder and prior to selective melting process.

MINEA T, WALRAND G, EFFERNELLI A, CRESPI A E

Electrically conductive composition used for decorative or building underlayer material, comprises base material, fluid binder and interactive powder material having preset particle size and electrical resistivity.

BARDOU M