国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C09J（5）
IPC C08G018/48（2） C08G018/66（2） C08K003/04（2）
C09J009/02（2） C09J011/04（2） C09J163/00（2）
发明人
公开年 2023（5）
申请年 2023（5）
专利权人

High-barrier heat-resistant solvent-free polyurethane composite material useful as film lamination in packaging composite field of e.g. daily chemical, comprises e.g. polyurethane prepolymer, graphene modified polyol, polyester polyol, nano-silicon dioxide modified polyether polyol and isocyanate.

HE C, TIAN L, WEN Y

Laminated waterproof and antibacterial medical packaging material comprises polycarbonate, sodium polyacrylate, isomeric tristyryl polyoxypropylene ether polymer, benzenesulfonyl chloride, N, N'-dimethylmethylene acrylamide, polyvinyl chloride, cetyltrimethylammonium bromide and polyethylene glycol.

ZHU X, CHEN C

Carbon dioxide-based bi-component polyurethane thermal-conducting adhesive comprises isocyanate terminated double ended polyurethane prepolymer, spherical alumina as thermally conductive filler, polyether polyol, polybutadiene polyol and small molecule polyol.

CAO Y, LIU T, LIN H, ZHANG X

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Conductive adhesive useful in IGBT module chip, comprises lignin-based epoxy resin, modified graphene and curing agent; lignin-based epoxy resin is obtained by polymerization of hydroxylated lignin and epoxy resin, modified graphene is obtained by treating carbon materials with coupling agent.

LIAO G, DUAN J