国家/地区 韩国（2）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08G059/50（3）
发明人
公开年 2023（3）
申请年 2021（2） 
专利权人

Manufacturing composite material comprises e.g. preparing foam structure using composite resin containing hexanediol diacrylate and graphene, preparing composite by filling structure with mixture and curing composite.

HOUN K J, CHOI H J

Epoxy resin composite material with low viscosity and high mechanical strength for preparing high performance epoxy system with low viscosity and high mechanical strength comprises epoxy resin, curing agent, multidimensional composite dispersion liquid and reinforcing agent.

CHENG J, CHEN Y, ZHANG J

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K