国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08G（5） C08J（5） C08K（5）
C08L（4） C09K（2）
IPC C08G073/10（5）
发明人 ZHOU H（5）
公开年 2023（2）
申请年 2023（2） 
专利权人 UNIV HARBIN .（2） UNIV JILIN（2）

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Flame-retardant and wave-absorbing polyimide foam material comprises an electric loss type/magnetic loss type wave absorbing composite material that is compounded in polyimide foam.

ZHOU G, NIE H, HUANG Z, GU M, ZHOU H

Preparing phenyl silsesquioxane/graphene oxide/polyimide three-phase composite film comprises e.g. dissolving expanded graphite with mixed acid solution, adding potassium permanganate, centrifuging, grinding and ultrasonically vibrating.

ZHOU H, WANG X, ZHANG H, JIN L

Producing silica hollow sphere/graphene oxide/polyimide composite film for printed circuit board, involves carrying out template method to obtain core-shell structure of microspheres, and sintering to obtain nano-silica hollow spheres.

JIN L, YANG Y, ZHOU H