国家/地区 美国（2）
IPC部 B（2）
IPC大类 B82（2）
IPC小类 B82Y（2）
IPC B82Y030/00（2）
发明人
公开年 2012（2）
申请年
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Solubilizing allotropes of carbon comprises providing a solute of fullerene, graphene or polymer of fullerene, combining with terpene, lactone or alcohol; providing cavitation, and ultracentrifuging to yield a true solution.

ROSTRO B, KOHANLOO M