国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2） C08L（2）
IPC C08K003/08（2）
发明人
公开年 2023（2）
申请年 2023（2）
专利权人

Heat dissipation material used in heat dissipation of heat generating devices, comprises graphene, silver nanoparticles and polyvinylidene fluoride, where graphene vinyl is modified and dispersed in polyvinylidene fluoride, and silver nanoparticles are adsorbed on graphene surface.

HU B, GUO H, LI B

Ultra-thin low-resistance conductive polymer film, obtained by blending polymer, conductive substances and auxiliary agent to form blend, extruding and stretching into film and electroplating via copper sulfate solution to further grow copper on film.

ZHAO W, REN J, LI G, HU Y, JIANG Y, MA Y, ZHI L