国家/地区 台湾（4）
IPC部 B（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08K003/04（4）
发明人 CHAKI N K（2） RAUT R（2） RUSTOGI A（2）
SHAH C P（2） SINGH B（2）
公开年 2018（2）
申请年 2018（2） 
专利权人 ALPHA ASSEMB.（2）

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Surface-metalized polymer article comprises polymer component, first layer composed of multiple graphene sheets and conducive filler coated on polymer component surface, and second layer of plated metal deposited on first layer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z, LI S

Multilayered structure used for making membrane touch switch and fabrication of sensors and biosensors comprises flexible substrate, layer comprising a metal ink, layer comprising a graphene ink and layer comprising dielectric ink.

CHAKI N K, SHAH C P, DAS B, DEVARAJAN S, SARKAR S, RAUT R, SINGH B, RUSTOGI A, HARRIS A J, PARSONS K P, BRAHAM J W

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q