国家/地区 中国（6）
IPC部 B（7）
IPC大类 B32（7）
IPC小类 B32B（7）
IPC C08K003/04（7）
发明人
公开年 2022（6）
申请年 2022（7）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Antibacterial and deodorant comfortable elastic functional insole useful in shoe-making industry and health care, comprises e.g. insole body including breathable mesh fabric layer, sponge layer and polyurethane foam layer arranged in sequence.

ZHU J

Backboard useful in fields of mobile phone backboard, comprises silicone layer, reinforcement layer and polycarbonate layer arranged in sequence from top to bottom, which has ultra-thin thickness, high strength and stain proof.

LIU W, GAN X, XU X, TAO Y

Ultrathin conductive foam for electronic device, comprises conductive film comprising polymethyl methacrylate, graphene powder, formaldehyde and foam component comprising, vinyl silicone oil, aluminum hydroxide and methyl silicone oil, and adhered to surface of foam component.

JIANG S, ZHANG W

Preparing a electric response shape memory composite material useful in electric drive shape memory polymer material low resistor and high stability, comprises e.g. taking shape memory polymer solution/prepolymer solution, dispersing and forming uniform conductive slurry and coating into groove mold.

LIU Y, ZHANG F, HU R, LENG J

Wave-absorbing heat-conducting gasket useful in thermal interface material and electronic equipment, prepared into aerogel by constructing three-dimensional thermal conduction path by directional freezing of liquid nitrogen and prepared by pouring liquid silicone rubber.

LI H, DONG B