国家/地区 韩国（7）
IPC部 C（7） B（3）
IPC大类 C08（7）
IPC小类 C08K（7） C08L（6） B33Y（2）
C01B（2） C08J（2）
IPC C08K009/02（7）
发明人 KOO B C（3） LEE H（3） RYU J S（3）
YOU N H（3） KU B（2） LEE S（2）
SIK C（2）
公开年 2022（3）
申请年 2021（3） 
专利权人 KOREA INST SCI TECHNOLOGY（7）

Composite material having improved flame retardancy useful for producing carbon fibers, comprises copolymer resin including first repeating unit including polyacrylonitrile, and filler dispersed in copolymer resin.

KOO B C, KIM J H, SIK C, YOU N H, RYU J S

Composite material comprises matrix comprising polyphenylene sulfide, and filler including carbon material doped with sulfur, dispersed in matrix.

KOO B C, SIK C, PARK J Y, YOU N H, RYU J S

Depolymerizing fiber-reinforced composite material useful in textile material for field of automobiles comprise introducing composite material and heterogeneous element precursor into water containing non-condensable solvent.

CHAE J, LEE S, WOO K, KIM Y N, KIM K W, KIMYOUNGO

Conductive composite resin composition for photocurable three-dimensional printed material, comprises photoreactive viscosity decreasing agent, photocurable resin and conductive nanostructures, and has specified viscosity.

LEE H, KIM S, KIM S W, SANGHYE K, CHUN D

Sulfur doped reduced graphene oxide used for polyimide nanocomposite, comprises sulfur and reduced graphene oxide, and has preset peak intensity ratio obtained by Raman analysis.

YOU N H, KU B, YU J, JANG S G, KOO B C, RYU J S

Composite material used in manufacture of fused deposition modeling-type three-dimensional printer polymer filament, comprises specified amount of graphene-coated metal nanoparticles, nanocarbons and polymer resin.

HWANG J, PARK S G, LIM J S, JO W, LEE H J, MOON M, KU B, HWANG J Y, JO W J, MOON M W, KU B C, HUANG J, PARK S, LIN C, ZHAO Y, LEE H, YEON H J, GYU P S, SEONG I J, JIN C W, JU L H, UN M M, CHEOL G B, LIM J

Electroconductive particle comprising a polymer microparticle and graphene coating layer grafted on the polymer microparticle, useful in anisotropic conductive film for packaging electronic devices.

LEE S, KIM K, LIM S H, PARK M, KIM J K, KIM H, LEE H, KIM G, IM S, KIM J, KIM K H, KIM H S, YI S S, I H J, SU LEE S, SUK KIM H, JEONG LEE H, GYEONG KIM J, HO IM S, LEE S S