国家/地区 韩国（9）
IPC部 C（9）
IPC大类 C08（9）
IPC小类 C08K（9） C08L（6） C01B（2）
C08F（2）
IPC C08K009/02（9）
发明人 KOO B C（2） RYU J S（2） SIK C（2）
YOU N H（2）
公开年 2022（4） 2023（3） 2021（2）
申请年 2021（9）
专利权人 KOREA INST S.（3）

Polyolefin-based composite material composition for forming e.g. impact reinforcing material, comprises polyolefin resin, and particulate carbon nanostructure in which shell layers comprising graphene layer or fullerene layer are stacked.

CHOI E, YOO Y S, KIM T J, LEE S H, PARK C H

Production of waste plastic composite material used for forming intermediate product, involves dissolving compatibilizer containing maleic anhydride and dicumyl peroxide in solvent, mixing mixture with waste plastic, precipitating mixture with excess acetone, drying and polymerizing mixture.

CHOI D Y, CHOI S W

Polydimethylsiloxane composite for heat dissipation/flame retardancy in field of automobiles and electrical/electronic comprises metal hydroxide-coated carbon body as filler based on polydimethylsiloxane.

SHIM S E, HWANG S, SO J, LEE K

Polyol-modified aspartic two-component polyurea-based composition useful as e.g. heat dissipation adhesive for electronic devices, comprises aspartic ester resin and polyol, polyisocyanate, and thermally conductive inorganic filler.

KIM H J, JANG J G, SEO K H

Composite material having improved flame retardancy useful for producing carbon fibers, comprises copolymer resin including first repeating unit including polyacrylonitrile, and filler dispersed in copolymer resin.

KOO B C, KIM J H, SIK C, YOU N H, RYU J S

Composite material comprises matrix comprising polyphenylene sulfide, and filler including carbon material doped with sulfur, dispersed in matrix.

KOO B C, SIK C, PARK J Y, YOU N H, RYU J S

Heat dissipation and electromagnetic wave shielding composite material useful for electronic device package comprises electromagnetic wave shielding layer disposed between first insulating layer and second insulating layer.

NAM J, SEOL M, HWANG E, PARK I

Conductive composite resin composition for photocurable three-dimensional printed material, comprises photoreactive viscosity decreasing agent, photocurable resin and conductive nanostructures, and has specified viscosity.

LEE H, KIM S, KIM S W, SANGHYE K, CHUN D

Conductive ink composition for removing static electricity, comprises filler having silver-coated core-shell structure, specific multi-component binder, viscosity/reflectance modifier containing carbon black and/or graphene, and solvent.

YEONG H, TO Y, LEE S Y