国家/地区
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2） C09K（2）
IPC C08K003/04（2）
发明人
公开年 2021（2）
申请年 2020（2） 
专利权人

High heat-conducting graphene floor heating pipe comprises pipe body, polyethylene layer, steel wire net layer, and graphene heat-conducting layer including graphite, antioxidant, dispersant, coupling agent, heat stabilizer, and plasticizer.

XU W, LIU Y, ZHANG H

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y