国家/地区 中国（2）
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29B（2）
IPC C08K003/04（2）
发明人
公开年 2022（2）
申请年 2022（2）
专利权人

Preparing radiating micro-structure heat composite material useful in electronic device, comprises depositing high molecular aqueous solution into heat-conducting filler with filter film, freezing, cooling, drying, injecting thermosetting polymer, vacuumizing heating and curing.

HU R, FAN Y, YANG X, ZHOU S, XIE B, ZHANG X, LUO X

Engineering plastic comprsing polyethylene, polytetrafluoroethylene and copolymer, coupling agent, reinforcing filler, synthetic rubber, fire retardant and antioxidant, is prepared by adding hyperbranched polyurethane, filler and rubber to molten premix, extruding, cooling and molding masterbatch.

WANG J