国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 B29（2）
IPC小类 B29C（2）
IPC C08K003/04（2）
发明人
公开年 2022（2）
申请年 2020（2） 
专利权人

Thermally conductive gasket used in electronic device, has adjacent thermally conductive fillers in direct contact to form a three-dimensional thermally conductive network containing internal voids and inner voids of three-dimensional thermally conductive network filled with high molecular polymers.

JIANG N, LIN Z, CHU W, DAI W, LI M, YU J

Weather-resistant and heat-insulating polycarbonate (PC)/polymethyl acrylate (PMMA) composites used for buildings comprises polycarbonate, poly(methyl methacrylate), composite toughening agent, compound compatibilizer, chain extender, coupling agent, nano antimony doped tin dioxide.

YAO W, HUANG W, JIA F, KONG J, WU Z