国家/地区 中国（3）
IPC部 B（3） C（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC C08K003/22（3）
发明人 WANG L（3）
公开年 2022（2）
申请年 2021（2） 
专利权人

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Honeycomb interlayer wave absorbing material for improving inclined incident wave absorbing performance, comprises a first skin, a wave absorbing aramid fibre honeycomb core, a wave absorbing putty and a second skin.

MENG L, HU D, WANG L, WANG Y, MING P, PENG X

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M