国家/地区 中国（6）
IPC部 B（6） C（6） H（2）
IPC大类 B32（6）
IPC小类 B32B（6）
IPC C08L063/00（6）
发明人 ZHANG J（6）
公开年 2018（3） 2021（3）
申请年 2020（3）  2017（2） 
专利权人 ENN GRAPHENE.（2） INST METAL R.（2）

Preparing organic substrate composite material comprises e.g. preparing semi-curing structure, pre-treating fiber filler, implanting into semi-curing structure, preparing filler solution and stable film structure, freezing and drying.

ZHANG J, CAO L, WANG Q

High thermal conductivity carbon fiber composite material with laminated hybrid structure comprises combination of carbon fiber cloth layer, sheet filler thermal conductivity network, and sheet sandwich ball laminated structure.

WANG H, SUN X, ZHANG J, MA C, LU N, ZENG Y, REN W, LIU C, CHENG H

Laminated composite material with graphene interpenetrating network structure comprises carbon fiber cloth layer, graphene foam layer, three-dimensional continuous graphene network and resin matrix.

ZENG Y, SUN X, WANG H, ZHANG J, MA C, REN W, CHENG H

Graphene-based PCB copper-clad plate, comprises copper-clad laminate prepreg, copper foil and prepreg, and a layer of chemical vapor deposited graphene between copper foils.

ZHANG J, ZHANG Y, XU Y, FENG S, WANG Q

Mobile terminal backplane comprises heat conductive layer containing graphene and/or graphene oxide, and a thermosetting resin; and a protective layer.

ZHANG J, LI J

Backplane of mobile terminal, comprises thermally conductive layer containing graphene and/or graphene oxide, and thermosetting resin, reinforcing layer containing glass fiber powder and thermosetting resin, and protective layer.

ZHANG J, LI J