国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3）
IPC C08L063/00（3）
发明人 SUN R（3）
公开年
申请年
专利权人 SHENZHEN INS.（3）

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure, and includes graphene microspheres, epoxy resin and curing agent.

ZENG X, LI C, SUN R, ME Y

Thermal conducting composite material useful in printed circuit board circuit board and electronic packaging thermal interface materials and other fields, comprises graphene/copper composite material as thermally conductive filler.

SUN R, LIU S, FU X