国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08J（3） C08K（3） C08L（3）
H05K（2）
IPC C08L063/00（3）
发明人 CHEN C（3）
公开年 2023（3）
申请年 2022（3） 
专利权人 CHANGSHU SHE.（2） SHENGYI TECH.（2）

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Resin composition useful in preparing low-flow adhesive prepreg comprises epoxy resin, epoxy curing agent, curing accelerator, carboxylated nitrile rubber, carbodiimide compound.

ZHANG W, CHEN C, HE J

Silicone foam sheet comprises silicone resin composition modified chitosan sol solution, where silicone resin composition includes carbohydroxy modified organopolysiloxane, epoxy resin, polylactic acid, alkyl phenol polyoxyethylene ether, sodium bicarbonate, water and zinc stearate.

CHEN C, LIN J